The 3rd IEEE International Conference on High Performance and Smart Computing
(IEEE HPSC 2017)
May 26th-28th, 2017, Beijing, China.

Committees and Organizations

General Chair
Shikun Zhang, Peking University, China
Sun-Yuan Kung, Princeton University, USA
Meikang Qiu, Pace University, USA
Co-General Chair
Wen Gao, Peking University, China. 高文(院士)
Hong Mei, Beijing Institute of Technology, China. 梅宏(院士)
Program Chairs
Shikun Zhang, Peking University, China
Biao Wang, University of International Relations, China
Yongxin Zhu, Shanghai Jiaotong University, China
Industry Chair
Peng Zhang, SUNY Stony Brook, USA
Operation Chair/Web Chair
Keke Gai, Pace University, USA
Publicity Chair
Yuanchao Shu, Microsoft Research Asia, China
Zhoujun Li, Beihang University, China
Local Chair
Ping Wang, Peking University, China
Yu Huang, Peking University, China
Guangquan Xu, Tianjin University, China
Technical Program Committee
Shui Yu, Deakin University, Australia
Zongming Fei, University of Kentucky, USA
Xiaolin wang, Peking University, China
Donggang Cao, Peking University, China
Yingwei Luo, Peking University, China
Richard Sinnott, University of Melbourne, Australia
Prem Chhetri, RMIT, Australia
William Voorsluys, University of Melbourne, Australia
Angus Macaulay, University of Melbourne, Australia
Paul Rad, Rackspace, USA
Syed Rizvi, The Pennsylvania State University, USA
Abdul Razaque, University of Bridgeport, USA
Katie Cover, The Pennsylvania State University, USA
Sanket Desai, San Jose State University, USA
Mohan Muppidi, UTSA, USA
Younghee Park, San Jose State University, USA
Sang-Yoon Chang, Advanced Digital Science Center, Singapore
Jin Cheol Kim, KEPCO KDN, Korea
William de Souza, University of London, United Kingdom
Malik Awan, Cardiff University, United Kingdom
Mehdi Javanmard, Rutgers University, USA
Allan Tomlinson, University of London, United Kingdom
Mohsen Amini Salehi, University of Louisiana Lafayette, USA
Ngoc Tu Nguyen, Missouri University of Science and Technology, USA
Bharat Rawal, Pennsylvania State University, USA
Zhuo Feng, Michigan Technological University, USA
Jian Zhang, Institute of Software, Chinese Academy of Sciences, China
Shui Yu, Deakin University, Australia
Hiroyuki Sato, The University of Tokyo, Japan
Gang Qu, University of Maryland, USA
Hao Chen, Shanghai Tech University, China
Wei Zhang, Southern Illinois University, USA
Wei Yu, Towson University, USA
Zhiqiang Lin, University of Texas at Dallas, USA
Chiu Tan, Temple University, USA
Bo Luo, The University of Kansas, USA
Xin Li, Carnegie Mellon University, USA
Hai Jiang, Arkansas State University, USA
Zhipeng Wang, China Electronics Standardization Institute, China
Jiang Xu, Hong Kong Universtiy of Science and Technology, China
Tao Zhang, Northwest Polytechnical University , China
Wen-Ping Lai, Yuan Ze University
Yunchuan Sun, Beijing Normal University, China
Yan Zhang, University of Oslo, Norway
Haibo Zhang, University of Otago, New Zealand
Wei Song, Nanjing University of Science and Technology, China
Pengcheng Zhang, Hohai University, China
Hao Hu, Nanjing University, China
Jidong Ge, Nanjing University, China
Suman Kumar, Troy University, USA
Peng Sun, University of Huston, USA
Yangbin Tang, National Defense University of China, China 
Jian Mao, BeiHang, China
Shuai Ma, BeiHang, China
Gang Xie, Taiyuan University of Technology, China
Zhihui Du, Tsinghua University, China
Jian Yin, Pacific Northwest National Laboratory, USA
Jiahai Yang, Tsinghua Univesity, China
Fuji Ren, The University of Tokushima, Japan
Long Fei, Google Inc. USA
Xiaofu He, Columbia University Medical Center, USA
Ukka Riekki, University of Oulu, Finland
Xingfu Wu, Texas A&M University, USA
Wenbo Zhu, Google Inc. USA
Hwajung Lee, Radford University, USA
Dean Anderso, Bank of America Merrill Lynch, USA
Yong Guan, Iowa State University, USA
Chao-Tung Yang, Tunghai University
Zongming Fei, University of Kentucky, USA
Zonghua Gu, Zhejiang University, China
Younghee Park, San Jose State University, USA
Wei Wei, Xi'an University of Technology, China
Gang Zeng, Nagoya University, Japan
Denis Trystram, Grenoble university, France
Thomas Austin, San Jose State University, USA
Sang-Yoon Chang, Advanced digital sciences center, Singapore
Hui Zhao, Henan University, China
Yi Jin, Shanghai University, China
Lei Ju, Shandong University, China
Yong Zhang, The University of Hong Kong, China
Xinjun Mao, National University of Defense Technology, China
Samee Khan, North Dakota State University, USA
Rui Mao, Shenzhen University, China
Yu Hua, Huazhong University of Science & Technology, China
Kenli Li, Hunan University, China
Jun Wu, National Pingtung University, China





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